Seoul National University
Electronics Processing
Research Laboratary
  • INTRODUCTION > ResearchFields > Electrodeposition

Electrodeposition

Electrodeposition for fabrication the interconnections

 

 


 

 

Gap-filling with organic additives

The Mechanism of Bottom-up Filling (Superfilling)

 

 

Cu Electrodeposition


Ag Electrodeposition

 

Through Silicon Via (TSV) Filling for 3D Package (Pulse-Reverse Deposition with Leveler)

 

 

 

 

 

 

 

Film property improvements using pulse deposition

Pulse Deposition

 

Film Resistivity Improvements using Pulse Deposition


COPYRIGHT © 2008~2016 SNU CBE Mipro, ALL RIGHTS RESERVED.