Seoul National University
Electronics Processing
Research Laboratary
  • PUBLICATIONS > Patent > 국제특허

국제특허

PUBLICATIONS > Patent > 국제특허 목록
일자 구분 출원/등록번호 발명의 명칭
2009-07-09 등록 7,545,043(미) Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
2008-08-05 등록  7,407,636(미)  Reformer for fuel cell system and method of manufacturing reaction substrate used for the same
2007-04-19 출원  20070087935(미)  Micro reforming reactor for fuel cell and method of preparing the same
2005-02-22 등록  6,858,479 (B2),(미)  Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same
2004-10-19 등록  6,806,189 (B2), (미)  Method of silver (Ag) electroless plating on ITO electrode
2004-09-28 등록  6,797,135 (B2), (미)  Electroplating Apparatus
2004-04-16 등록  6,706,628 (B2), (미)  Method for forming thin film and method for fabricating liquid crystal display using the same
2003-10-28 등록  6,637,443 (B2), (미)  Semiconductor wafer cleaning apparatus and method
2003-03-18 등록  6,532,976 (B1), (미)  Semiconductor wafer cleaning apparatus
2002-12-30 출원  10/330,431 (미)  Method of silver (Ag) electroless plating on ITO electrode
2002-12-30 출원  10/323,946 (미)  Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same
2002-12-23 출원  10/326,486 (미)  Semiconductor wafer cleaning apparatus and method
2002-04-16 등록  6,372,116 (B1), (미)  A method of forming a conductive layer and an electroplatng apparatus thereof
2002-03-06 출원  10/090,753 (미)  Electroplating Apparatus
2001-11-02 출원  09/985,342 (미)  Method for forming thin film and method for fabricating liquid crystal display using the same
1999-11-16 등록  5,985,125 (미)  Selective copper deposition method
1999-09-15 출원  09/396,202 (미)  A method of forming a conductive layer and an electroplatng apparatus thereof
1999-04-23 등록  2916616 (일)  System and method for cleaning a semiconductor wafer
1999-02-23 등록  5,873,948 (미)  Method for removing etch residue material
1998-09-04 등록  2821869 (일)  Selective copper deposition method
열린1페이지 2페이지 맨끝

COPYRIGHT © 2008~2016 SNU CBE Mipro, ALL RIGHTS RESERVED.